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LinkedIn Post Text: Press Release – A new European Union consortium created to accelerate the development of next-generation, edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test, and fabricate new circuits from across Europe. Coordinated by CEA-Leti, Fraunhofer-Gesellschaft, imec and VTT, the hashtag#PREVAIL project is a multi-hub platform providing prototype chip fabrication capability in advanced artificial intelligence technology to EU stakeholders. Read more: https://lnkd.in/em8pnHYk

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Media Link: https://www.imec-int.com/en/press/eu-consortium-developing-next-gen-edge-ai-technologies-accepting-design-proposals
Media Link Content: EU consortium edge-AI technologies accepting proposals | imec
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EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
Press release
EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
CEA-Leti, Fraunhofer, imec and VTT Anchoring Multi-Hub Platform toogy Life sciences and health solutions Data and telecommunication Automotive technologies Robotics technology for Industry 4.0 More applications / EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals Press release EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals CEA-Leti, Fraunhofer, imec and VTT Anchoring Multi-Hub Platform to Realize Designs By EU Companies, Researchers and Chip Developers GRENOBLE, France – February 27, 2024 – A new European Union consortium created to accelerate the development of next-generation, edge-AI technologies is installing cleanroom tools and gearing up to design, evaluate, test and fabricate new circuits from across Europe. Coordinated by the EU’s four leading research and technology organizations (RTOs), France’s CEA-Leti, Germany’s Fraunhofer-Gesellschaft, Belgium-headquartered imec and Finland’s VTT, the PREVAIL project is a networked, multi-hub platform providing prototype chip fabrication capability in advanced artificial intelligence technology to EU stakeholders. In most cases, the technology offer will be based on commercial foundry processes, and advanced technology modules will be enhanced in the cleanrooms of the project partners. ‘The PREVAIL project’s ultimate goal is to position Europe with an easy-access, advanced manufacturing infrastructure enabling users to make early research samples of innovative and trustworthy products and accelerate their commercialization,’ said Sergio Nicoletti, CEA-Leti business development manager and PREVAIL project manager. ‘And while bringing their cutting-edge technologies to a higher maturity level and giving users the possibility to fabricate and test AI prototypes based on these technologies, the RTOs are reaping the benefits of technological cross-fertilization.’ ‘In addition to providing high-performance, low-power edge components and technologies to support the massive data-processing requirements of AI, the project will help energize the EU’s digital transformation, a precursor to the goals of the European Chips Act,’ he said. Launched at the end of 2022, the project is leveraging the RTOs’ advanced 300 mm fabrication, design and test facilities and related expertise to create the Testing and Experimentation Facility for Edge-AI Hardware (TEF Edge AI HW). This network will validate new high-performanoject will help energize the EU’s digital transformation, a precursor to the goals of the European Chips Act,” he said. Launched at the end of 2022, the project is leveraging the RTOs’ advanced 300 mm fabrication, design and test facilities and related expertise to create the Testing and Experimentation Facility for Edge-AI Hardware (TEF Edge AI HW). This network will validate new high-performance, low-power, edge-AI components and support an infrastructure capable of fabricating early research prototype samples for testing in innovative edge-AI applications. Nicoletti said the consortium is working with selected SMEs, the RTOs’ industrial partners and academic labs to prepare early designs that will be used to test fabrication equipment in the RTOs’ facilities. The project plans to open access widely for EU designers by May 2026. While 80 percent of the project’s budget targets equipment suited for design, testing and fabrication of edge-AI devices, the project also will reinforce the readiness of the RTOs’ to equip their new pilot lines for developing 3D integration technologies, which also are envisioned in the chips act. Key Project Components In addition to fabricating advanced edge-AI applications and creating the platform’s TEF Edge AI HW, the consortium will provide process design kits (PDKs) compatible with standard commercial CAD tools and all the elements necessary for full chip design. A user-interface team will manage relationships among the developers of next-generation, edge-AI solutions and the consortium. PREVAIL is the EU’s first step to link the RTO’s different infrastructures and synchronize and coordinate their investments to minimize duplication, and to jointly increase the technology readiness levels (TRLs) of tools in development. The nearly €156 million ($169.3 million) cost of the 42-month project will be shared by the RTOs’ countries and the European Commission. Approximately 80 percent of this funding is CAPEX invested in new tools suited for edge-AI devices. PREVAIL’s Founding Members CEA : The French research organization in energy, defense & security, information technologies and health technologies is coordinator of the project. CEA-Leti : The consortium is managed by CEA-Leti, which has about 11,000 m2 of cleanroom space and 300 mm fabrication capabilities equipped with more than 150 tools to prototype advanced hardware.ed for edge-AI devices. PREVAIL’s Founding Members CEA: The French research organization in energy, defense & security, information technologies and health technologies is coordinator of the project. CEA-Leti: The consortium is managed by CEA-Leti, which has about 11,000 m2 of cleanroom space and 300 mm fabrication capabilities equipped with more than 150 tools to prototype advanced hardware. This specialty is supported by a nano-characterization platform specializing in physical-chemical characterization techniques. Fraunhofer-Gesellschaft: Four Fraunhofer units in the Fraunhofer Group for Microelectronics are participating in the initial phase of the PREVAIL project: Fraunhofer IPMS’s Center Nanoelectronic Technologies (CNT), and Fraunhofer IZM-ASSID, the Center All Silicon System Integration Dresden, which will contribute with its 300 mm fabrication lines for CMOS compatible nanoelectronic technologies and advanced 3D wafer-level system integration. Fraunhofer EMFT will contribute chip-to-foil integration and physical analysis for trust, and Fraunhofer IIS will contribute by designing, measuring and testing CMOS integrated circuits enabled by its design and test experience in advanced semiconductor technologies down to 22nm. Imec: With about 12,000 m2 of cleanroom space, including a fully equipped 300 mm infrastructure, imec provides world-leading R&D on next-generation technology nodes serving the entire semiconductor ecosystem. The institute is applying its memory, 3D and photonics departments and unit process module department to help define PREVAIL’s technical offering. VTT Technical Research Centre of Finland Ltd operates in several research fields. Its Microelectronics and Quantum Technology Division and the Safe and Connected Society unit are participating in the consortium’s work. With deep system and connectivity expertise, VTT enables the consortium to renew the connectivity testbed with the latest edge-computing development equipment tools and 5G evolution network technology updates. For more information about CEA-Leti, go here. For more information about Fraunhofer-Gesellschaft, go here. For more information about imec, go here. For more information about VTT, go here. Co-founded by the European Union In addition to support from the European Commission, this work received funding from: the French National Research Agency as part ofG evolution network technology updates. For more information about CEA-Leti, go here. For more information about Fraunhofer-Gesellschaft, go here. For more information about imec, go here. For more information about VTT, go here. Co-founded by the European Union In addition to support from the European Commission, this work received funding from: the French National Research Agency as part of the France 2030 plan (ANR-22-PVIL-001) the Flemish Government (EWI department, project #VV023/11) the German Federal Ministry of Education and Research under the project reference number 16ME0834 the Business Finland as part of the Finnish Sustainable Growth and Next Generation EU programs (decision 4614/31/2022) More about these topics: General Published on: 27 February 2024 Share this article on Read more Blog General Imec’s forty-year microchip odyssey Vision General Automotive … 2024: The Year of Truth Blog General Artificial intelligence 2023 was a big year for AI, making it a big deal for everyone Press General Imec and Mitsui Chemicals partner to commercialize CNT pellicle technology for EUV lithography Vision CMOS: advanced & beyond General Why our chip strategy will determine our future Press General CMOS: advanced & beyond … Imec and ASML sign Memorandum of Understanding (MoU) to support semiconductor research and sustainable innovation in Europe Press General CMOS: advanced & beyond Rapidus, Japan’s newly founded chip manufacturer, joins imec’s Core Partner Program Press General Jim Morgan and Lip-Bu Tan Receive imec’s Lifetime of Innovation Award Blog General Sustainable development 2022: A Dark Year with A Silver Lining Blog General Sustainable development “Our Strength Lies in Union, Not Division” Listicle General Sustainable development 2022 Highlights Press General Imec and Rapidus sign Memorandum of Cooperation to collaborate on advanced semiconductor technologies Follow imec on: Expertise Dive into our expertise. 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Follow us on www.cea.fr/english and @CEA-Leti.

Technological expertise
CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products. For more information: www.cea.fr/english

@CEA | @CEATech | @CEA-List | @CEA-Liten
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hTechnological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products. For more information: www.cea.fr/english

@CEA | @CEATech | @CEA-List | @CEA-Liten
Website
http://www.cea-leti.com
External link for CEA-Leti
Industry
Semiconductor Manufacturing
Company size
1,001-5,000 employees
Headquarters
GRENOBLE
Type
Privately Held
Founded
1967
Specialties
microelectronics, innovation, Cybersecurity, Optics & Photonics, Quantum, Sensors, Medical Devices, microsystems, cleanroom, design, 5G, Artificial intelligence, Power Electronics, R&D, Research, Carnot, Computing, nanotechnology, prototyping, semiconductor, edgeIA, Lidar, Clinatec, cea, FDSOI, CMOS, Embedded Systems, Nanocharacterization, circuits design, Foundries, Startup, Smart Cities, Smart Manufacturing, IoT, Smart Health, Transport, Smart Energy, Defense & Space, and Smart Mobility
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GRENOBLE, 38054, FR
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Employees at CEA-Leti
Marc Donikian
Eric GOUZE
Michael Roukes
Fabrice BERNARD-GRANGER
Project manager innovatives technologies
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Updates
CEA-Leti
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[BEST OF] If you are interested in tech, you won’t want to miss this.
Our 2023 Highlights offers up bite-sized morsels of the CEA-Leti news that helped shape the global integrated circuit market last year.
This eminently browsable PDF contains 94 items covering:

Advances in
#microelectronics
, including amorphous chalcogenides, powerMEMS, in-memory and neuromorphic computing, advanced packaging, CMOS-over-CMOS and more…

Technological innovations for
#health
, with rapid food contaminant and
#antibiotic
sensitivity testing, microneedles in wearable patch form to measure biological parameters and deliver drugs, and futuristic organs-on-chip for tomorrow’s
#diabetes
care…

Partnerships with Renault Group, Terradona, Vitesco, Intel, LSTC (Rapidus Corporation), KAIST GCC, Applied Materials…technological innovations for
#health
, with rapid food contaminant and
#antibiotic
sensitivity testing, microneedles in wearable patch form to measure biological parameters and deliver drugs, and futuristic organs-on-chip for tomorrow’s
#diabetes
care…

🤝Partnerships with Renault Group, Terradona, Vitesco, Intel, LSTC (Rapidus Corporation), KAIST GCC, Applied Materials…

🚀News from our tech and
#deeptech
#startups
INJECTPOWER
,
ADMIR Analysis
,
ECLYPIA
,
Quobly
,
MICROOLED
,
Aledia
, and others (including some record-breaking fundraising rounds)…
 
It seems like wherever you looked in 2023, someone was talking or writing about
#chips
. As a leading center for IC R&D, CEA-Leti made quite a bit of its own chip-related news last year.
 
And it’s all in our quick and easy to read 2023 Highlights
#report
👇
https://lnkd.in/d22VYhuW
Sébastien Dauvè
|
Corinne Legalland
|
Jean-rené Lèquepeys
|
Michael Tchagaspanian
|
Thomas Ernst
|
IRT Nanoelec
|
Le Réseau des Carnot
|
Région Auvergne-Rhône-Alpes
|
CEA
42
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[ENERGY STORAGE] When operated at high frequencies, certain
#piezoelectric
materials display exceptional quality factors and power densities. 🔋

CEA-Leti and an academic research partner have been investigating how to bring these remarkable properties to power conversion in the form of a new inductor-free power converter concept based on mechanical, rather than magnetic,
#energy
storage.

« 𝔓𝔬𝔴𝔢𝔯 𝔱𝔬 𝔦𝔫𝔫𝔬𝔳𝔞𝔱𝔲𝔯𝔢 𝔱𝔬 𝔫𝔢𝔴 𝔰𝔬𝔩𝔲𝔱𝔦𝔬𝔫𝔰 𝔣𝔬𝔯 𝔰𝔱𝔬𝔯𝔞𝔤𝔢 𝔞𝔫𝔡 𝔪𝔞𝔫𝔞𝔤𝔢𝔪𝔢𝔫𝔱 𝔬𝔣 𝔭𝔬𝔴𝔢𝔯 »38jV SVMREI SEI HETRHM RTV UFEI NKMHAI RTEP AESHRIK HSFEIA UTVEKNEH RTIUVRTE YERISNA RTAMBEYN MRNEUNET EH TENAKVKFTERNAL. LAEI SMEPCHRT NAFIAE LAEI REVENI MEYHI FVAR FIETR SHAKNAN RYENTAL AVE HEEENAI HEI LREG OSI FEAVHTERNAK HIHE AHUHET CRCHN EA RTUV”We have 9 IMEC modules in our position,” said Dr. Ghislain Despesse. “Our focus is on the cutting-edge research in the field of nanotechnology and its applications.” This statement emphasizes the importance of advanced micro-electronic circuits to the development of innovative technologies.𝘴. 𝘐𝘵 𝘪𝘴 𝘱𝘢𝘳𝘵𝘪𝘤𝘶𝘭𝘢𝘳𝘭𝘺 𝘨𝘳𝘢𝘵𝘪𝘧𝘺𝘪𝘯𝘨 𝘧𝘰𝘳 𝘮𝘦 𝘵𝘰 𝘩𝘢𝘷𝘦 𝘮𝘰𝘷𝘦𝘥 𝘧𝘳𝘰𝘮 𝘴𝘪𝘮𝘱𝘭𝘦 𝘰𝘣𝘴𝘦𝘳𝘷𝘦𝘳, 𝘴𝘪𝘵𝘵𝘪𝘯𝘨 𝘰𝘯 𝘗𝘩𝘋 𝘥𝘪𝘴𝘴𝘦𝘳𝘵𝘢𝘵𝘪𝘰𝘯 𝘫𝘶𝘳𝘪𝘦𝘴 𝘢𝘵 𝘊𝘌𝘈-𝘓𝘦𝘵𝘪, 𝘵𝘰 𝘢 𝘧𝘶𝘭𝘭-𝘧𝘭𝘦𝘥𝘨𝘦𝘥 𝘱𝘢𝘳𝘵𝘯𝘦𝘳 𝘪𝘯 𝘵𝘩𝘪𝘴 𝘦𝘹𝘤𝘪𝘵𝘪𝘯𝘨 𝘳𝘦𝘴𝘦𝘢𝘳𝘤𝘩,” said
François COSTA
Research professor at the
Laboratoire SATIE
Université Paris-Est Créteil (UPEC)
|
Sylvain Bacquet
|
Marc Plissonnier
#piezoelectricity
Read more on 👇
Insulated recessed gate GaN power transistors enable promising normally-OFF architecture
leti-cea.com
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[ARTICLE] 📌 A warm thank you to the
Center for Strategic and International Studies (CSIS)
for its full and complete report about the CEA-Leti research institute. 📝
Which highlights key points such as:

◻ The Importance of Cransistors enable promising normally-OFF architecture
leti-cea.com
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[ARTICLE] 📌 A warm thank you to the
Center for Strategic and International Studies (CSIS)
for its full and complete report about the CEA-Leti research institute. 📝
Which highlights key points such as:

▪ The Importance of Cooperative
#Research
Organizations
▪ France’s Overhaul of Its Innovation System
▪ Grenoble’s High-Tech Cluster
▪ Lessons from the CEA-Leti Model

💬« 𝘞𝘢𝘺𝘴 𝘰𝘧 𝘏𝘰𝘯𝘦𝘴𝘵 𝘌𝘥𝘶𝘤𝘢𝘵𝘪𝘰𝘯 𝘴𝘩𝘰𝘶𝘭𝘥 𝘣𝘦 𝘰𝘶𝘳 𝘨𝘰𝘢𝘭, 𝘢𝘯𝘥 𝘷𝘪𝘤𝘦 𝘷𝘦𝘳𝘴𝘢, 𝘵𝘩𝘢𝘵 𝘪𝘴 𝘵𝘩𝘦 𝘮𝘢𝘳𝘬 𝘰𝘧 𝘢 𝘵𝘳𝘶𝘦 𝘤𝘪𝘷𝘪𝘭𝘴𝘦𝘥 𝘴𝘰𝘤𝘪𝘦𝘵𝘺. »38ževǫdebkóäděstí pänkězkterno wurde vi der Gegran v lěbörńětęchedi dolčązy krásno journałjędzenio cetero integer hendræt arcu dapibus. Thank you very much SUJAI SHIVAKUMAR, Ph.D. Charles Wakefield Wessner and Thomas Howell. ✒ Read the full article here 👇 Invest In Grenoble Alpes | Le Réseau des Carnot | Minalogic | Sébastien Dauvè | Jean-rené Lèquepeys | FMNT | IRT Nanoelec #research #technology #semiconductor #France #Grenoble The French Model for Cooperative Semiconductor Research: Lessons from CEA-Leti csis.org 26 1 Comment Like Comment Share CEA-Leti 27,150 followers 4d Report this post [EVENT] 📣 𝝿ellar untey pesisp 🝌lountain 🝍mation 𝝿everfor Cooperative Semiconductor Research: Lessons from CEA-Leti
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[EVENT] 📣 𝐿𝐶𝐸𝒪 𝒿𝑜𝒾𝓃 𝐿𝐸𝓉𝒾’𝓈 𝒹𝒾𝒼𝒾𝓉𝒶𝓁 𝒾𝓃𝒹𝓃𝑜𝓋𝒶𝓉𝒾𝑜𝓃 𝓌𝑜𝓇𝓀𝓈𝒽𝑜𝓅. Register Now!

Join CEA-Leti CEO
Sébastien Dauvé
and a panel of tech experts in Hsinchu on April 9, 2024 📅

Global
#semiconductor
R&D leader CEA-Leti is bridging the gap between lab and fab as the partner of choice for innovative businesses seeking a one-stop-shop for their advanced technology R&D needs.
CEA-Leti R&D partners benefit from the institute’s state-of-the-art R&D facilities and proven
#technology
transfer program.🤝

Don’t miss this opportunity to meet with CEA-Leti and partners and explore the potential for R&D partnerships in
#Taiwan
.

This event is organized in collaboration with
SEMI
and the French Office in
#Taipei
, which is the official representation of France in Taiwan and is strongly involved to foster cooperation in all fields, including
#semiconductors
.

🎤 A keynote speech will be given by
Pierre Barnabé
, CEO,
SOITEC
🙋♂️ Speakers: Franck Paris |
Tuo-Hung (Alex) Hou
|
Clark Tseng
|
Martin Gallezot
|
Sylvie Joly
|
Benoit Charbonnier
|
Michael Tchagaspanian
|
Olivier THOMAS
Le Réseau des Carnot
#Letidays
#event
Leti Innovation Day Taiwan 2024
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[EUROPEAN PROJECT] 🤝 PREVAIL was launched by the EU to accelerate the development of next-generation, edge-AI technologies. The EU’s 4 leading RTOs: CEA-Leti,
Fraunhofer-Gesellschaft
,
imec
and
VTT
, are installing cleanroom tools as they gear up to design, evaluate, test and fabricate new circuits submitted from across Europe.

🌍 Their networked, multi-hub platform will provide prototype, chip-fabrication capability in advanced artificial technology to EU stakeholders. In most cases, the technology offsetsing RTOs: CEA-Leti, Fraunhofer-Gesellschaft, imec and VTT, are installing cleanroom tools as they gear up to design, evaluate, test and fabricate new circuits submitted from across Europe. 🌍 Their networked, multi-hub platform will provide prototype, chip-fabrication capability in advanced artificial technology to EU stakeholders. In most cases, the technology offer will be based on commercial foundry processes, and advanced technology modules will be enhanced in the cleanrooms of project partners. “Your success is truly our achievement,” says VTT’s head of microelectronics, project coordinator Erja Turunen, and continues, pointing to a handful of microprocessors that are fabricated on standard silicon wafers: ‘For us, the step to 90-65-40 nm complementary metal-oxide-semiconductor (CMOS) technology node production is in fact natural.’35 perceived decision consequences option to follow help lead projector property established business opportunity said Sergio Nicoletti CEA-Leti business development manager and project manager. We plan pushing forward on-chip photonics, right-isolated collaborative center with option lead academic European networks through imec.When designing high-performance Next-Generation Edge-AI technologies, choosing the right hybrid edge/cloud architecture and methods is crucial. We help to leverage the ability of both the Edge and Cloud to execute real-time AI applications by combining the best of both worlds. By offloading non-time-sensitive calculations to the Cloud, we can prioritize low power, fast processing, and real-time decision making at the Edge. Learn more about our hybrid architecture capability and how imec. is leading the way in powering next-generation AI applications.

Meet the team at the Leti Innovation Days 2024, on the Partners’ Corner!
📅 June 25-27, 2024 – Grenoble, France
#EU
#AI
#EdgeAI
#ChipsAct
#RTOs
#Research
#DigitalTransformationEuropean Union
EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
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[AWARD] As soon as a new sensor series is produced, a whole team is waiting in the wings, ready to test them. 🧑‍🔬

CongratulationspsAct
#RTOs
#Research
#DigitalTransformation
European Union
EU Consortium Developing Next-Gen Edge-AI Technologies Is Accepting Design Proposals
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[AWARD] As soon as a new sensor series is produced, a whole team is waiting in the wings, ready to test them.🤓

Congratulations to
Jules Tillement
for winning the Best Student Paper prize at the 2023 International Image Sensor Workshop! 📃

After earning a Materials Engineering diploma from
INSA Lyon – Institut National des Sciences Appliquées de Lyon
, Jules Tillement did a final internship in a research laboratory specializing in image
#sensors
. He was then recruited to pursue a
#doctorate
at
STMicroelectronics
, in partnership with CEA-Leti.

“𝑅𝑒𝑠𝑒 search is very simple. Look at what others are looking at and think something different.” said Albert Szent-Györgyi, a notable Hungarian physiologist who won the Nobel Prize in Physiology or Medicine in 1937 for his discovery of vitamin C and the components and reactions of the citric acid cycle. The consortium for developing the next-generation Edge-AI technologies encourages all innovators to believe in their unique ideas and contribute to the groundbreaking advancements in this field. The consortium is currently accepting design proposals for the upcoming projects. Get involved and be part of this transformative journey!835..imec and imec nft nft nft nft nft.🎯 More information about his research 👉
https://lnkd.in/dE9v8Axs
Jacques Baylet
|
christophe jany
|
Thomas Di Rito
|
Sylvain Georges
|
Gabriel Mugny
| Olivier Saxod |
Olivier Gravrand
|
Frédéric Berger
|
Thierry Baron
|
Francois ROY
|
Frédéric Boeuf
|
Laboratoire des Technologies de la Microélectronique – LTMLab
#infrared
#research
#talent
#phd
AWARD – Congratulations to Jules Tillement for winning the best student paper prize!
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[EVENT] CEA-Leti researchers will present 5 presentations and 4 posters 📃 at SPie Advanced Lothograpzy Paternizing Conference.
Join CEA-Leti and other leading researchers who are solving challenges in:
✔optical and EUV lithography,
✔patterning technologies,
✔DTCO and Computational Patterning,
✔metrology, and process integration…

…for semiconductor manufacturing and adjacent applications.
#event
#semiconductor
#lithography
🙋‍♀️
Chiara Sabbione
|
Ivanie MENDES
| Nacima Allouti |
Julie Spinelli
|
Aurélien Fay
Aurélien Sarrazin
|
Ujwol Palanchoke
|
Raphaël Feougier
|
Timothée Choisnet
|
Merlin Moreau
|
Assia SELMOUNI
|
Laurent Pain
CEA-Leti @SPIE Advanced Lithography + Patterning
leti-cea.com
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[CONFERENCE] 👩‍🔬ne \n|\n Ivanie MENDES \n| Nacima Allouti |\n Julie Spinelli \n|\n Aurélien Fay Aurélien Sarrazin \n|\n Ujwol Palanchoke \n|\n Raphaël Feougier \n|\n Timothée Choisnet \n|\n Merlin Moreau \n|\n Assia SELMOUNI \n|\n Laurent Pain CEA-Leti @SPIE Advanced Lithography + Patterning leti-cea.com 54 Like Comment Share CEA-Leti 27,150 followers 1w Report this post [CONFERENCE] 🧑‍🔬♀️CEA-Leti reported at the ISSCC 2024 gathering in San Francisco that it has developed an accurate keyword-spotting system at power consumption below one microwatt. This dramatically improves accuracy in always-on, voice-activated #edgeAI systems and consumes less power in a far smaller silicon footprint than current technology. \n \n💬 Presented in a paper titled “0.4V 988nW Time-Domain Audio Feature Extraction for Keyword Spotting Using Injection-Locked Oscillators”, the institute’s new architecture uses time-domain signal processing on oscillators locked by injection and is suitable for devices running on energy harvesters, which supply power below 0.5V. \n \n“𝑬𝑶𝑺𝑬𝒂𝑬𝑪𝒂𝑺𝑖𝒀 𝑰𝑰𝒇𝑰𝑽𝒐𝒆𝑪𝒕𝑰𝑯3.5𝑯𝑵𝑰𝒏𝒀” said Ali MOSTAFA, lead author of the paper. “𝑾𝑶𝙰 988R, 𝑰𝑮u24 is u30u26u34 u30u25u26 65u2f, said
Ali MOSTAFA, lead author of the paper. It is u3au22 u31u30u38u26u33 u30u27 988u2f, u36u33 u34u3au34u35u26u2e u2aU34 u2fu2au2fU26 U35u2au2eu26u34 U2eU30u33U26 U31U30U38u26u33-u22U2fU25-u22U33u26U22 U2eU27u27u2aU24U2aU26u2f35 U35u22u2f 35u33u2aU28-U30u34u24u2aU2du2d22u35u33u30U33-u23u22U26U25 U1bU0b-U0dU0cU39.

Beyond speech recognition, the system can be used for predictive maintenance and health monitoring that require on-line frequency decomposition of the sensor data.

Discover CEA-Leti’s technologies 👉
https://lnkd.in/d_ggi-3k
#speech
#recognition
#artificialintelligence
#ia
#ISSCC
International Solid-State Circuits Conference – ISSCC
|
Franck Badets
| Emmanuel HARDY
CEA-Leti Develops Novel Architecture for Keyword-Spotting (KWS) In Always-On, Voice-Activated Edge-AI Systems
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[CONFERENCE] It may be hard to pronounce or spell, but piezoelectricity can be a workhorse in the right environment, e.g. computers operating voice-recognition software or quartz watches. Simply put, it is a charge (
#electric
polarization) that gathers in crystalline materials when they are subjected to mechanical stress. 🔌

CEA-Leti, which has been working on
#piezoelectricity
for many years and a variety of applications, teamed up with scientists at the University of California Sannt, e.g. computers operating voice-recognition software or quartz watches. Simply put, it is a charge (electric polarization) that gathers in crystalline materials when they are subjected to mechanical stress.🔌 CEA-Leti, which has been working on piezoelectricity for many years and a variety of applications, teamed up with scientists at the University of California San Diego to develop a ground-breaking piezoelectric-based DC-DC converter that unifies all power switches onto a single chip to increase power density. This new power topology blends the advantages of piezoelectric converters with capacitive-based DC-DC converters. The results were recently presented in the paper, “An Integrated Dual-side Series/Parallel Piezoelectric Resonator-based 20-to-2.2V DC-DC Converter Achieving a 310% Loss Reduction”, at International Solid-State Circuits Conference – ISSCC 2024 in San Francisco.📃 “The Dual-side Series/Parallel Piezoelectric Resonator (DSPPR) is the first IC used for PR-based power conversion, and achieves up to 310% loss reduction over prior-art published and co-designed discrete designs for VCRs Preferences Preference cookies enables the web site to remember information to customize how the web site looks or behaves for each user. This may include storing selected currency, region, language or color theme.Analytical cookies Analytical cookies help us improve our website by collecting and reporting information on its usage.Marketing cookies Marketing cookies are used to track visitors across websites to allow publishers to display relevant and engaging advertisements. 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