Company: imec
LinkedIn Post Text: Press Release – At IEDM 2024, imec presents breakthrough results in the hetero-integration of InP chiplets on a 300mm RF silicon interposer, achieving a negligible 0.1dB insertion loss at 140GHz. Researchers observed zero performance degradation upon assembly of a two-stage InP power amplifier (PA). As the first to achieve this, imec’s findings mark a significant milestone in developing compact, energy-efficient modules for above 100GHz communication and radar sensing.Full press release: https://lnkd.in/e3QGb9w2
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Links Inside Post Json: [“https://lnkd.in/e3QGb9w2”]
Content For Links Inside Post Json: {“https://lnkd.in/e3QGb9w2”: “Seamless InP chiplet integration on RF silicon interposer | imec\nExpertise\nWhat we offer\nApplications\nYour career\nAbout imec\nContact\nCMOS: advanced and beyond\nDiscover why imec is the premier R&D center for advanced logic & memory devices.\nIntegrated photonics\nTake a look at technologies for
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