Company: imec
LinkedIn Post Text: Press release – at the IEEE ECTC 2025 conference, imec showcases its high-performance, flexible 300mm RF silicon interposer platform. It enables seamless integration of RF-to-sub-THz CMOS and III/V chiplets on a single carrier, achieving a record-low insertion loss of 0.73dB/mm up to 325GHz—advancing compact, low-loss, scalable RF and mixed-signal systems.Read more: https://lnkd.in/ej6gB3T2
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Content For Links Inside Post Json: {“https://lnkd.in/ej6gB3T2”: “Imec\u2019s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz\nExpertise\nWhat we offer\nApplications\nYour career\nAbout imec\nContact\nCMOS: advanced and beyond\nDiscover why imec is the premier R&D center for advanced logic & memory devices.\nIntegrated photonics\nTake a look at technologies for optical transceivers, sensors a
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