Company: imec
LinkedIn Post Text: Press Release – Today at hashtag#ECTC24, imec presents a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at
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Media Link: https://www.imec-int.com/en/press/imec-demonstrates-die-wafer-hybrid-bonding-cu-interconnect-pad-pitch-2mm
Media Link Content: D2W hybrid bonding with 2-µm Cu interconnect pad pitch | imec
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