Company: D3 Engineering
LinkedIn Post Text: The next generation of Physical AI systems will intelligently fuse raw data — radar I/Q samples, HDR image sensor bayer pixels, lidar phase data, and ultrasound chirps — into actionable intelligence to build safer, smarter systems. This collaboration with Texas Instruments and D3 Embedded uses HSB to bring raw radar data directly into GPU memory for Holoscan processing — plus it’s the first platform to use NVRadar for automotive/robotics applications. Definitely look for this on the show floor at GTC!
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